Thermal Grizzly TG Putty Advance 30G – Non-Conductive Thermal Pad Alternative, 0.2–3.0mm Gap Filler, GPU VRAM/VRM Use, Good Thermal Conductivity, Easy to Apply

Expert FeaturesDesigned for GPU Modding: Ideal for replacing thermal pads on graphics cards and adapting to various cooler configurations.High Flexibility: Easily molded into shape for precise application on components like VRAM, SMDs, and VRMs.Good Thermal Conductivity: TG Putty Advance delivers reliable thermal transfer for high-performance GPU cooling.Gap Filling Precision: Efficiently fills height differences from 0.2 mm to 3.0 mm, eliminating uneven contact issues.Electrically Non-Conductive: Safe to use around sensitive electronics with no risk of electrical shorts.Customizable Application: Apply using included spatulas for broad coverage or by hand (with gloves) for targeted spots.Scalable Usage: One 30g container is typically enough for most single or even high-end GPUs like the RTX 4090 (front-side).Alternative to Thermal Pads: Simplifies replacements by avoiding the need for multiple pad thicknesses.Temperature Resilient: Operates effectively in environments from -40°C to 120°C.Includes Tools: Comes with 3 spatulas for easy and controlled spreading.Not for CPUs or GPU Dies: Specifically engineered for PCB-to-cooler use cases—not suitable for direct die application.Clean Application Surface Required: For optimal results, clean surfaces thoroughly before applying (use TG Cleaning Wipes or isopropyl alcohol).Expert SpecsSpecificationDetailsProduct NameThermal Grizzly TG Putty AdvanceVolume30 gramsThermal ConductivityGoodElectrical ConductivityNon-conductiveApplication AreasGPU VRAM, VRM, SMD – PCB to Cooler Gap FillingGap Filler Range0.2 mm to 3.0 mmOperating Temperature-40°C to 120°CSuitable ForGraphics Cards Only (Not CPU or GPU die)Application MethodBy hand (gloves recommended) or spatulaTools Included3x SpatulasRecommended Surface PrepDegreased and cleaned (TG Wipes / isopropanol)